5G


AC5035
Qualcomm SDX35 | LGA | 4Gb NAND + 4Gb LPDDR2 MCP
Specification
Platform | Qualcomm SDX35 |
Memeory | 4Gb NAND + 4Gb LPDDR2 MCP |
Form Factor | LGA |
Size | 28 x 25.5 x 2.2 mm |
5G NR,SA mode | n1, 2, 3, 5, 7, 8, 12, 13, 14, 18, 20, 25, 26, 28, 30, 38, 40, 41, 48, 66, 70, 71, 77, 78, 79 |
LTE Cat 4 | B1, 2, 3, 4, 5, 7, 8, 12, 13, 14, 17, 18, 19, 20, 25, 26, 28, 30, 34, 38, 39, 40, 41, 42, 43, 48, 66, 70, 71 |
Embedded GNSS | YES |
PCIe 2.0 | Supported |
USB 2.0 | Supported |
eSIM | Optional |
SGMI | Supported |
Fucntion Temperature | -30 °C to 75 °C |
Product Overview
The AMPAK Technology® AC5035 module is a versatile 3GPP Release 17 Reduced Capability (RedCap) module powered by the Qualcomm SDX35 chipset, which supports 4G and 5G technologies and is designed using an advanced 4nm process for superior performance and power efficiency. Developed as a low-power, cost-effective 5G wireless communication module, it complies with 3GPP Release 17 standards and is tailored for mid-speed IoT applications. This module emphasizes integration and industrial adaptability, making it ideal for applications in smart cities, healthcare, vehicle-to-everything (V2X), and manufacturing. Furthermore, it offers hardware and software integration through AT commands and an API Guide, allowing clients to perform development verification and customization for diverse application needs.