Component Assembly and Packaging :

• SMT(Surface Mounting Technology)more
• 01005 Chip / 0201Chip / CSP and Solder Bumped
• Flip Chip Bonding / N2 Solder Reflow

• COB (Chip On Board)more
• Ceramic, Rigid, Flexible, Glass Board
• Wafer Sawing / Plasma Cleaning / Chip And Wire (Die Bond, Wire Bond)

• Flip Chipmore
• Bumping (Au Stud) / Bonding (Au Stud, C4)

• Encapsulationmore
• Dispensing (Glob Top, Underfill)
• Over Molding (Organic, Lead Frame, Ceramic)
• VPES (Vacuum Printing Encapsulation System)

• Singulation&packingmore
• Saw Cutting / Snapping/Routing