Camera Module
Metallized Substrate
Component Assembly and Packaging
Available Package and Application
Testing
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Metallized Substrate
．Single Layer / Double Side / Multi-Layer
．Through Hole / Via Fill / Castellation
．6 mil Line Width and Space
．Passive/Active Trim on Resistor, Capacitor, Coil
．Nickel / Gold / Solder Electroless Plating Finishing
．Resistor on LTCC
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