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Component Assembly and Packaging |
 SMT (Surface Mounting Technology) :
0201Chip / CSP / Lead-Free Solder / N2 Solder Reflow.
Clip Insertion and Solder Dipping :
SIP / DIP
Flux Removing :
CFC Free Cleaning Solvent (NPB)
COB (Chip On Board) :
Ceramic, Rigid, Flexible, Glass Board
Wafer Sawing / Plasma Cleaning / Chip And Wire (Die Bond, Wire Bond)
Flip Chip :
Bumping (Au Stud) / Bonding (Au Stud, C4) |
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SMT(Surface Mounting Technology) Line
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Encapsulation :
Capping (Ceramic, Plastic, Glass, Metal)
Dispensing (Glob Top, Underfill)
Over Molding (Organic, Lead Frame, Ceramic)
Singulation :
Saw Cutting/ Snapping
Packing :
Tray / Tube / Reel Tape / Vacuum Bag
Form-In-Place :
Conductive (EMI Shielding) / Non-Conductive (Water Proof)
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