capability
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Camera Module
Metallized Substrate
Component Assembly and Packaging
Available Package and Application
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R&D Capability

AMPAK consistently enforces its software, hardware and firmware design capability to offer the utmost cost-effective designs & efficient solutions to customers. Engineering support includes from the initial design consultation, OEM projects conversion, ODM design, to full turnkey solutions. Furthermore, AMPAK strongly utilizes our engineering support in all product developing stages covering circuitry design, layout design, engineering sample fabrication & verification, pilot run, volume manufacturing and cost reduction programs.
AMPAK is proud of its experienced engineering talent for extremely efficient project development with expertise in production and test set up, on site customer support and quick turn around prototyping.


Camera Module

Product Development Capability
AMPAK has been involving in 1.3 MFF Compact Camera module starting 2004, successfully phase in mass production in 2.0 MAF and 3.0MAF module in 2005 and 2006 respectively.

R&D Design Capability
Experienced R&D team : excellent in system integration, optics design, package design, image processing and technical service.
camera module
CCM Characterization Qualification

.SNR Measurement- low light performance
.Resolution- Analyzed thru software
.Dynamic Range- Sensor Response over different lighting conditions
.Color Reproduction- Color response to CIE Color Coordinate Chart
.Noise- Image quality at low light conditions
.Relative Illumination- Measure of uniformity across image
.TV Distortion- Lens performance measure
.Optical Centre- Centre of gravity of image
.Stray Light- Measure of “Ghosting Effect”
.Flare- Image Wash out
.Color Crosstalk- Pixel Color Response


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