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Available Package and Application |
．Air Cavity Ceramic Package (PA Module, Saw Device, RF IC...)
． Air Cavity Plastic Package (Area Array/Linear Image Sensor...)
． Leadless Metal Lidded Cermic Package (Diplexer Switch...)
．Leadless Metal Lidded Plastic Package (VCO...)
． Over-Molded Ceramic Package (RFIC, RF Filter...)
． Over-Molded Plastic Package (PA Module, SDIO...)
． Flip Chip Package (Hearing Aid Module, GPS Module,
Bluetooth Module,
WLAN Module...)
． Thick Film Hybrid / LTCC Package (Automotive,
Communication Medical...)
． Module Product (Bluetooth Module, Front End Module,
WLAN Module,Compact Camera Module...) |
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