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TOcan Package & Testing

  • TO46 Package
  • TO46 Package more
  • APD CoC :  XYZ <+/- 5 um
  • Die/Wire Bond :  XY<+/- 15 um, +/- 3 um
  • Capping :  +/- 20um(50um passive)
  • Leak Testing :  1x10-9 c.c.-ATM/sec
  • Burn-In Testing :  2~400uA, Up to 150℃
  • TO46 O/E Testing :  Vbr (V): RT and 85℃, Id (nA), Icc (mA)
  • TO56 Package
  • TO56 Package more
  • Epoxy Die Bond :  XY <+/- 25 um
  • Eutectic Die Bond :  X <+/- 20, Z <+/-10 um, θ<+/- 1 °
  • Wire Bond :  +/- 6 um
  • Capping/Leak Test :  <1 x 10 -8 c.c.-ATM/sec, 1x10-9 c.c.-ATM/sec
  • Burn-In Testing :  Up to 150℃, 0~25 V, 5V~25 V
  • TO56 O/E Testing :  Ith(mA), Iop (mA), La (mW), Vf (V), η(mA/mW)
  • TO46/56 Burn-In & Testing
  • TO46/56 Burn-In & Testing more
  • Leaking Test :  1x10-9 c.c.-ATM/sec
  • Burn-In Testing :  Up to 150℃, 0~25 V, 5V~25 V
  • TO46 O/E Testing :  Vbr (V): RT and 85℃, Id (nA), Icc (mA)
  • TO56 O/E Testing :  Ith(mA), Iop (mA), La (mW), Vf (V), η(mA/mW