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EPS
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EPS (Electronic Packaging Service)

Multilayer thick film interconnect on ceramic substrates with a typical 6 mil line width and spacing. Material systems include pure silver & gold, and blends of silver / gold / platinum / palladium. Precise passive and active trim on resistors, capacitors and coils in a main strength of this technology as well as stability over wide temperature ranges and severe conditions. A variety of finishes can be plated onto thick film including nickel and gold as well as solder electroless finish.

Design:
1. Package Design:
Material Selection/Recommendation..
Structure Analysis
Thermal Management

2. Substrate Layout:
Transmission Line
Thick Film Substrate
PCB
HTCC
LTCC
EPS (Electronic Packaging Service)

Thick Film Metallization Substrate:
1. Metallization: Pd/Pt/Ag, Pd/Ag, Ag, Au.
2. Insulation : Dielectric, Glassivation.
3. Printing: Single Layer, Double Side, Multi-Layer.
4. Through Hole: 12mil to 20 mil.
5. Via Fill: 8 mil to 12 mil.
6. Castellation (edge Metallization): 12 mil to 24 mil.
7. Line Width: 6 mil.
8. Line Space: 6mil.
9. Passive Components: Resistor, Capacitor, Inductor.
10. Plating Finish: Cu , Ni/Au , Solder.
Assembly / Packaging:
1. Surface Mount Technology (SMT)
2. Chip On Board (COB)
3. Sealing
4. Singulation
5. Packing

  Electronic Packaging Service
 
Available Package Type:
1. Leadless Package (Castellation, LGA)
2. BGA Package
3. Hermetically Package
4. Clipped Package

Assembly Flow Chart:
1. Air Cavity Package
2.
Air Cavity Module Package
3.
Over Molded Land Grid Array Package
4.
Over Molded Leadframe Package(QFN/MLP)
 

Testing

1.Test Capabilities
Frequency range: DC to 6 GHz.
Array Test : DC, Functional.
Piece Test: DC, Functional.
RF Test: S Parameter(SWR,Gain/Loss,Isolation), P1dB,
Noise Figure, TOI, Harmonic Distortion.

2. Auto Test Handler
X/Y table --------Array testing.
Pick& Place-----Individual unit testing

3. Test Instruments(RF Performance Testing):
Vector Network Analyzer up to 6G (Agilent 8753ES)
Vector Network Analyzer up to 6 G (Anritsu MS4623B)
Vector Signal Generator up to 6 G(Agilent E4438C)
Spectrum Analyzer up to 26.5G (Agilent E4407B)
Power Meter & Sensor up to 18G (Agilent E4418B+E4412A)
Noise Figure Analyzer up to 6.7G (Agilent N8974A)
Frequency Counter up to 12.4G (Agilent 53131A)
I-Q View Tester up to 6G (LitePoint)
I-Q Flex Tester up to 6G (LitePoint)
RF Switch (Agilent 87130/87206B)
Power Pre-Amplifier (Agilent 83006A)


4. Test Instruments (Audio and Testing):
Vector Network Analyzer up to 6G (Agilent 8753ES)
Vector Network Analyzer up to 6 G (Anritsu MS4623B)
Vector Signal Generator up to 6 G(Agilent E4438C)
Spectrum Analyzer up to 26.5G (Agilent E4407B)
Power Meter & Sensor up to 18G (Agilent E4418B+E4412A)
Noise Figure Analyzer up to 6.7G (Agilent N8974A)
Frequency Counter up to 12.4G (Agilent 53131A)
I-Q View Tester up to 6G (LitePoint)
I-Q Flex Tester up to 6G (LitePoint)
RF Switch (Agilent 87130/87206B)
Power Pre-Amplifier (Agilent 83006A)



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