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Manufacturing Capability |
Ampak possesses have quite intact full-automatic software and hardware production equipments for the
manufacturing field of module packaging and testing on the application of wireless communication/ Imaging
product/ Video information and mobile industry use, it more plan there is omni-directional the module
packaging process such as: High precision and high density SMD placement , In-Line Optics Checking,
Wafer Dicing, Die Bonding, Wire Bonding, Flip chip Bonding, Epoxy Encapsulation, Molding, Capping and
the Automatic Function Testing.
We have built and constructed a SPC System to every key process to control the mechanism of ability to
ensure the process stability under controlled. We make with rigorous responsible attitude to all process
control and offer excellent manufacture quality for basic principle in order to be manufactured.
 Thick Film Hybrid
．Single Layer / Double Side / Multi-Layer
．Through Hole / Via Fill / Castellation
．6 mil Line Width and Space
．Passive/Active Trim on Resistor, Capacitor, Coil
．Nickel / Gold / Solder Electroless Plating Finishing
．Resistor on LTCC
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