 Solder Paste Printing
Printing Accuracy: +/- 0.050mm
Board Thickness: 0.2mm minimum
Lead-Free Solder:96.5Sn/3.5Ag,96.5Sn/3.0Ag/0.5Cu
Substrate Material: Ceramic (HTCC/LTCC/Thick Film),
Organic (BT/GETEK/FR4…)
Board size (mm): 50 x 50 x 0.2 to 330 x 250 x 2.0
Pick & Place:
Placement Accuracy: +/-0.05mm
Chip0201--gap 0.15mm,CSP-- pitch 0.65mm, BGA-- pitch 1.0mm,
QFP, PLCC, SO, Melf, Flip Chip—pitch> 0.2 mm
Clip Insertion:
Ceramic Substrate or Organic PCB.
Solder Ball Placement:
Solder sphere: 14mil/16mil/20mil/25 mil/30 mil
Bonding pitch: 25 mil minimum
Solder Reflow
Temperature----- Up to 350 oC
Atmosphere------ Air, N2(Oxygen Content <100 ppm)
Solder Dipping:
SIP, DIP
Flux Removing:
NPB----Solvent of CFC Free
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