Thick Film Hybrid SMT COB FC (Flip Chip) Encapsulation Singulation & Package Holder Mounting Home FC (Flip Chip) ．Pre-Solder Connection ．Pre-Flux Connection ．Epoxy Encapsulated Solder Connection ．Thermo-Sonic Connection ．Bonding (Au Stud, C4) ．Bumping (Au Stud)   Stud Bump
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