capability
AMPAK
AMPAK
Thick Film Hybrid
SMT
COB
FC (Flip Chip)
Encapsulation
Singulation & Package
Holder Mounting
Home

Encapsulation


.Capping (Ceramic, Plastic, Glass, Metal)
.Dispensing (Glob Top, Underfill)
.Over Molding (Organic, Lead Frame, Ceramic)

  Encapsulation
Dispenser
 

 . HomeAbout AMPAKProduct & ServiceR&D CapabilityManufacturabilityQualityContact Us
AMPAK Technology Copyright (c) 2008 AMPAK Technology Inc . All right reserved. Best viewed by 1024 X 768 resolution
+886-3-4333646